Quick question on VIAs

[Warlock]

Originally Posted by lufcfan

Do you guys have any tips on filling the VIAs up with solder to turn then into more of a pad than a hole? I've read a few sites, but a few personal expereiences and tips would be far more useful... Thanks a lot... LUFCfan

To me its easier to do this if you are using solder paste because you can apply it to the VIA then touch with the iron for a instant creating a pad. I have done it both ways, anymore i just scrape the VIA's, I then pre-tin my wires and tip them with a little flux then attach to the board. Like Tyler said, bond is instantanious and takes only a split second.