|
|
|
#1
07-07-2003, 10:58
|
|||
|
|||
|
Lacquer on Soldering Points
According to the M2 Pro installation guides on their website it says that the ground pads are covered in lacquer. I'm assuming these are just the pads labeled with GND.
Are there any other points that have lacquer that need to be scraped off? Do I just use a knife to scrape off the lacquer and how much effort do I need to remove the lacquer. Also, I'm aware that solder paste will remove lacquer, but I'm not planning on using it. Thanks. 
|
| Sponsored Links |
|
#2
07-07-2003, 12:43
|
||||
|
||||
|
Get urself a fibreglass pencil from RStools & scratch all the points before soldering.
__________________
[url=http://www.messiah-mod-chips.com/acatalog/Playstation2_modchips.html]A reg' mini metro Jack Russel 3 Ferrets Twede flat cap & a pinta Worthies![/url]
|
|
#3
07-07-2003, 12:47
|
||||
|
||||
|
The places where it matters are the VIA's, because the lacquer has really sunk into those. The bigger pads aren't an issue, by the time you've gotten it hot enough to attach solder, it's hot enough that the lacquer is long gone.
I'd use an exacto knife and scrape away all the VIA's, and any other pads that look suspiciously "glazed". - Gurm
|
 |
|
|
Hybrid Mode
